Professional PCB Words English and Chinese

Professional PCB Words English and Chinese

1. Comprehensive vocabulary:

1、 Printed Circuits:printed circuit
2、 Printed Circuit:printed wiring
3、 Printed Boards:printed board
4、 PCB Circuits:printed circuit board (pcb)
5、 Printed circuit boards:printed wiring board(pwb)
6、 Printed Components:printed component
7、 Printed Contacts:printed contact
8、 PCB Assembly:printed board assembly
9、 Board:board
10、 Single-sided PCB:single-sided printed board(ssb)
11、 Double-sided PCB:double-sided printed board(dsb)
12、 Multilayer PCB:mulitlayer printed board(mlb)
13、 Multilayer PCB:mulitlayer printed circuit board
14、 Multilayer printed circuit boards:mulitlayer prited wiring board
15、 Rigid PCB:rigid printed board
16、 Rigid single-sided PCB:rigid single-sided printed borad
17、 Rigid double-sided PCB:rigid double-sided printed borad
18、 Rigid multilayer PCB:rigid multilayer printed board
19、 Flexible multilayer PCB:flexible multilayer printed board
20、 Flexible PCB:flexible printed board
21、 Flexible single-sided PCB:flexible single-sided printed board
22、 Flexible double-sided PCB:flexible double-sided printed board
23、 Flexible Printed Circuits:flexible printed circuit (fpc)
24、 Flexible Printed Lines:flexible printed wiring
25、 Rigid PCB:flex-rigid printed board, rigid-flex printed board
26、 Rigid double-sided PCB:flex-rigid double-sided printed board, rigid-flex double-sided printed
27、 Rigid multilayer PCB:flex-rigid multilayer printed board, rigid-flex multilayer printed board
28、 Flush PCB:flush printed board
29、 Metal Core PCB:metal core printed board
30、 Metal-based PCB:metal base printed board
31、 Multi-cabling PCB:mulit-wiring printed board
32、 Ceramic Printed Panel:ceramic substrate printed board
33、 Conductive offset board:electroconductive paste printed board
34、 Molded circuit boards:molded circuit board
35、 Molded PCB:stamped printed wiring board
36、 Sequential laminated multilayer PCB:sequentially-laminated mulitlayer
37、 Loose line PCB:discrete wiring board
38、 Microline PCB:micro wire board
39、 Multilayer PCB:buile-up printed board
40、 Laminated multilayer PCB:build-up mulitlayer printed board (bum)
41、 Laminated flexoboard:build-up flexible printed board
42、 Surface Laminated Circuit Board:surface laminar circuit (slc)
43、 Embedding bumps with PCB:b2it printed board
44、 Multilayer film substrate:multi-layered film substrate(mfs)
45、 Interlayer full-internal conduction multilayer PCB:alivh multilayer printed board
46、 Carrier chip board:chip on board (cob)
47、 Buried Resistance Plate:buried resistance board
48、 Motherboard:mother board
49、 Daughter Board:daughter board
50、 Backplane:backplane
51、 Bare board:bare board
52、 Keyboard board sandwich panel:copper-invar-copper board
53、 Dynamic Flex:dynamic flex board
54、 Static Flex:static flex board
55、 Breakable panels:break-away planel
56、 Cable:cable
57、 Flexible Flat Cables:flexible flat cable (ffc)
58、 Membrane Switches:membrane switch
59、 Hybrid Circuits:hybrid circuit
60、 Thick Film:thick film
61、 Thick Film Circuits:thick film circuit
62、 Membrane:thin film
63、 Thin-film hybrid circuits:thin film hybrid circuit
64、 Interconnection:interconnection
65、 Conducting wire:conductor trace line
66、 Flush wires:flush conductor
67、 Transmission Lines:transmission line
68、 Cross-Deposit:crossover
69、 Plate side plug:edge-board contact
70、 Reinforcement Plate:stiffener
71、 Basis:substrate
72、 Substrate Surface:real estate
73、 Traverse Surface:conductor side
74、 Component Faces:component side
75、 Welded surface:solder side
76、 Printed:printing
77、 Grid:grid
78、 Graphics:pattern
79、 Conductive Graphics:conductive pattern
80、 Non-conductive graphics:non-conductive pattern
81、 Character:legend
82、 Sign:mark

Two PCBSubstrate:

1、 Substrate:base material
2、 Laminate:laminate
3、 Metal-clad foil substrate:metal-clad bade material
4、 Copper-clad foil laminate:copper-clad laminate (ccl)
5、 Single-sided copper-clad foil laminates:single-sided copper-clad laminate
6、 Double-sided copper clad foil laminates:double-sided copper-clad laminate
7、 Composite laminates:composite laminate
8、 Thin laminates:thin laminate
9、 Metal core copper clad laminate:metal core copper-clad laminate
10、 Metal-based copper-clad laminates:metal base copper-clad laminate
11、 Flexible copper clad foil insulating film:flexible copper-clad dielectric film
12、 Matrix Material:basis material
13、 Prepreg Material:prepreg
14、 Adhesive sheet:bonding sheet
15、 Prepreg Adhesive Sheet:preimpregnated bonding sheer
16、 Epoxy glass substrate:epoxy glass substrate
17、 Laminates for addition method:laminate for additive process
18、 Prefabricated inner foil cladding:mass lamination panel
19、 Inner coreboard:core material
20、 Catalytic Plates:catalyzed board ,coated catalyzed laminate
21、 Gluing catalytic laminates:adhesive-coated catalyzed laminate
22、 Gluing non-urging laminate:adhesive-coated uncatalyzed laminate
23、 Adhesive layer:bonding layer
24、 Adhesive film:film adhesive
25、 Adhesive insulating film:adhesive coated dielectric film
26、 Unsupported adhesive film:unsupported adhesive film
27、 Covering:cover layer (cover lay)
28、 Reinforced Panels:stiffener material
29、 Copper foil surface:copper-clad surface
30、 Remove the copper foil surface:foil removal surface
31、 Laminate Surface:unclad laminate surface
32、 Base film surface:base film surface
33、 Adhesive side:adhesive faec
34、 Original Smooth Finish:plate finish
35、 Rough noodles:matt finish
36、 Longitudinal:length wise direction
37、 Orientation:cross wise direction
38、 Clipboard:cut to size panel
39、 Phenolic paper copper clad laminate:phenolic cellulose paper copper-clad laminates(phenolic/paper ccl)
40、 Epoxy paper copper clad laminate:epoxide cellulose paper copper-clad laminates (epoxy/paper ccl)
41、 Epoxy glass cloth base copper clad laminate:epoxide woven glass fabric copper-clad laminates
42、 Epoxy glass cloth paper composite copper clad foil board:epoxide cellulose paper core, glass cloth surfaces copper-clad laminates
43、 Epoxy glass cloth glass fiber composite copper clad laminate sheet:epoxide non woven/woven glass reinforced copper-clad laminates
44、 Polyester glass cloth copper clad foil sheet:ployester woven glass fabric copper-clad laminates
45、 Polyimide glass cloth copper clad laminate:polyimide woven glass fabric copper-clad laminates
46、 Bismaleimide triazine epoxy glass cloth copper clad foil sheet:bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates
47、 Epoxy synthetic fiber cloth copper clad foil sheet:epoxide synthetic fiber fabric copper-clad laminates
48、 Polytetraethylene fiberglass copper clad laminate:teflon/fiber glass copper-clad laminates
49、 Ultra-thin laminates:ultra thin laminate
50、 Ceramic-based copper clad laminate:ceramics base copper-clad laminates
51、 UV-blocking copper clad laminates:uv blocking copper-clad laminates

Three PCBThe material of the substrate

1、 aOrder resins:a-stage resin
2、 bOrder resins:b-stage resin
3、 cOrder resins:c-stage resin
4、 Epoxy resin:epoxy resin
5、 Phenolic resin:phenolic resin
6、 Polyester resin:polyester resin
7、 Polyimide resins:polyimide resin
8、 Bismaleimide triazine resin:bismaleimide-triazine resin
9、 Acrylic resin:acrylic resin
10、 Melamine formaldehyde resin:melamine formaldehyde resin
11、 Polyfunctional epoxy resins:polyfunctional epoxy resin
12、 Brominated epoxy resins:brominated epoxy resin
13、 Epoxy phenolic:epoxy novolac
14、 Fluororesin:fluroresin
15、 Silicone:silicone resin
16、 Silanes:silane
17、 Polymer:polymer
18、 Amorphous polymers:amorphous polymer
19、 Crystallization phenomenon:crystalline polamer
20、 Twin Crystalline Phenomenon:dimorphism
21、 Copolymer:copolymer
22、 Synthetic resin:synthetic
23、 Thermosetting resins:thermosetting resin
24、 Thermoplastic resins:thermoplastic resin
25、 Photosensitive resins:photosensitive resin
26、 Epoxy equivalent:weight per epoxy equivalent (wpe)
27、 Epoxy value:epoxy value
28、 Cyandiamide:dicyandiamide
29、 Binders:binder
30、 Adhesive:adesive
31、 Curing agent:curing agent
32、 Flame retardants:flame retardant
33、 Brightening Block:opaquer
34、 Plasticizer:plasticizers
35、 Unsaturated polyester:unsatuiated polyester
36、 Mylar:polyester
37、 Polyimide films:polyimide film (pi)
38、 Polytetrafluoroethylene:polytetrafluoetylene (ptfe)
39、 Polyperfluoroethylene propylene film:perfluorinated ethylene-propylene copolymer film (fep)
40、 Reinforcements:reinforcing material
41、 Fiberglass:glass fiber
42、 eFiberglass:e-glass fibre
43、 dFiberglass:d-glass fibre
44、 sFiberglass:s-glass fibre
45、 Glass Cloth:glass fabric
46、 Nonwovens:non-woven fabric
47、 Fiberglass Mats:glass mats
48、 Yarn:yarn
49、 Monofilament:filament
50、 Gynostemma:strand
51、 Weft:weft yarn
52、 Warp:warp yarn
53、 Daniel:denier
54、 Meridional:warp-wise
55、 Laft direction:weft-wise, filling-wise
56、 Fabric warp and weft density:thread count
57、 Fabric Structure:weave structure
58、 Plain weave:plain structure
59、 Bad Cloth:grey fabric
60、 Scrim fabrics:woven scrim
61、 Bow Weft:bow of weave
62、 Menstrual period:end missing
63、 Lack of weft:mis-picks
64、 Weft skew:bias
65、 Crease:crease
66、 Cloud weaving:waviness
67、 Fisheye:fish eye
68、 Terry length:feather length
69、 Thick and thin sections:mark
70、 Fissure:split
71、 Twist:twist of yarn
72、 Sizing content:size content
73、 Residual amount of sizing:size residue
74、 Treatment agent content:finish level
75、 Susizing:size
76、 Coupling Agent:couplint agent
77、 Treated fabrics:finished fabric
78、 Polyamide fibers:polyarmide fiber
79、 Polyester nonwovens:non-woven polyester fabric
80、 Impregnated insulating longitudinal paper:impregnating insulation paper
81、 Polyarylamide fiber paper:aromatic polyamide paper
82、 Break length:breaking length
83、 Water Absorption Height:height of capillary rise
84、 Wet Strength Retention:wet strength retention
85、 Whiteness:whitenness
86、 Ceramics:ceramics
87、 Conductive foils:conductive foil
88、 Copper foil:copper foil
89、 Electrolytic copper foil:electrodeposited copper foil (ed copper foil)
90、 Calendered copper foil:rolled copper foil
91、 Annealed copper foil:annealed copper foil
92、 Calendered annealed copper foil:rolled annealed copper foil (ra copper foil)
93、 Thin copper foil:thin copper foil
94、 Rubberized copper foil:adhesive coated foil
95、 Grease copper foil:resin coated copper foil (rcc)
96、 Composite metal foils:composite metallic material
97、 Carrier foil:carrier foil
98、 Yinwa:invar
99、 Foil (profile) profile:foil profile
100、 Smooth:shiny side
101、 Rough Side:matte side
102、 Treatment Surface:treated side
103、 Anti-rust treatment:stain proofing
104、 Double-sided treated copper foil:double treated foil

Four PCBdevise

1、 Schematic:shematic diagram
2、 Logic diagram:logic diagram
3、 Printed wiring layout:printed wire layout
4、 General layout plan:master drawing
5、 Design for Manufacturability:design-for-manufacturability
6、 Computer Aided Design:computer-aided design. (cad)
7、 CAM:computer-aided manufacturing. (cam)
8、 Computer Integrated Manufacturing:computer integrat manufacturing. (cim)
9、 Computer Aided Engineering:computer-aided engineering. (cae)
10、 Computer-aided testing:computer-aided test. (cat)
11、 Electronic Design Automation:electric design automation . (eda)
12、 Engineering Design Automation:engineering design automaton . (eda2)
13、 Assembly Design Automation:assembly aided architectural design. (aaad)
14、 Computer Aided Drafting:computer aided drawing
15、 Computer-controlled display:computer controlled display . (ccd)
16、 Layout:placement
17、 Wiring:routing
18、 Layout Design:layout
19、 Recloth:rerouting
20、 Mock:simulation
21、 Logic Simulation:logic simulation
22、 Circuit Simulation:circit simulation
23、 Timing Simulation:timing simulation
24、 Modularization:modularization
25、 Cabling completion rate:layout effeciency
26、 Machine Description Format:machine des criptionm format . (mdf)
27、 Machine Description Format Database:mdf databse
28、 Design Database:design database
29、 Design Origin:design origin
30、 Optimization (Design):optimization (design)
31、 Optimized axes for design:predominant axis
32、 Table Origin:table origin
33、 Mirror image:mirroring
34、 Driver Files:drive file
35、 Intermediate Documents:intermediate file
36、 Manufacturing Documentation:manufacturing documentation
37、 Queue Support Database:queue support database
38、 Component Placement:component positioning
39、 Graphical display:graphics dispaly
40、 Scale Factor:scaling factor
41、 Scan Fill:scan filling
42、 Rectangular filling:rectangle filling
43、 Populated Domains:region filling
44、 Solid Design:physical design
45、 Logical Design:logic design
46、 Logic Circuits:logic circuit
47、 Hierarchical Design:hierarchical design
48、 Top-down design:top-down design
49、 Bottom-up design:bottom-up design
50、 Line network:net
51、 Digitization:digitzing
52、 Design Rule Checks:design rule checking
53、 Wire Walker (Routing):router (cad)
54、 Netlist:net list
55、 Computer Aided Circuit Analysis:computer-aided circuit analysis
56、 Subline Network:subnet
57、 Objective Function:objective function
58、 Post-design processing:post design processing (pdp)
59、 Interactive Graphic Design:interactive drawing design
60、 Fee Matrix:cost metrix
61、 Drawings:engineering drawing
62、 Block Diagram:block diagram
63、 Maze:moze
64、 Component density:component density
65、 Itinerant Salesperson Questions:traveling salesman problem
66、 Degree of freedom:degrees freedom
67、 Penetration:out going degree
68、 Out-of-degree:incoming degree
69、 Manhattan Distance:manhatton distance
70、 Euclidean distance:euclidean distance
71、 Internet:network
72、 Array:array
73、 Segment:segment
74、 Logic:logic
75、 Logic Design Automation:logic design automation
76、 Branches:separated time
77、 Delamination:separated layer
78、 Order:definite sequence

Five Shape & Size:

1、 Wire (Channel):conduction (track)
2、 Wire (body) width:conductor width
3、 Wire Distance:conductor spacing
4、 Wire Layer:conductor layer
5、 Wire width/Spacing:conductor line/space
6、 1st Traverse Layer:conductor layer no.1
7、 Round Plate:round pad
8、 Square Plate:square pad
9、 Diamond Plate:diamond pad
10、 Rectangular pads:oblong pad
11、 Bullet Disc:bullet pad
12、 Teardrop Disk:teardrop pad
13、 Snowman Plate:snowman pad
14、 vShaped Disk:v-shaped pad
15、 Annular Disc:annular pad
16、 Non-round discs:non-circular pad
17、 Isolation disk:isolation pad
18、 Non-functional connecting discs:monfunctional pad
19、 Offset Connecting Disks:offset land
20、 Abdominal (dorsal) bare disk:back-bard land
21、 Address:anchoring spaur
22、 Connecting Disc Graphics:land pattern
23、 Connecting Disk Grid Array:land grid array
24、 Hole Ring:annular ring
25、 Component Holes:component hole
26、 Mounting Holes:mounting hole
27、 Support Holes:supported hole
28、 Non-support holes:unsupported hole
29、 Vias:via
30、 Plated vias:plated through hole (pth)
31、 Clearance Holes:access hole
32、 Blind vias:blind via (hole)
33、 Buried vias:buried via hole
34、 bury/Blind vias:buried /blind via
35、 Via Hole in Arbitrary Layer:any layer inner via hole (alivh)
36、 All Drilled Holes:all drilled hole
37、 Locating holes:toaling hole
38、 No Connecting Disc Holes:landless hole
39、 Intermediate Holes:interstitial hole
40、 No connecting disc vias:landless via hole
41、 Pilot Holes:pilot hole
42、 Terminate full poros:terminal clearomee hole
43、 Quasi-inter-surface coated vias:quasi-interfacing plated-through hole
44、 Quasi-size holes:dimensioned hole
45、 Through holes in the connecting disc:via-in-pad
46、 Hole Position:hole location
47、 Pore density:hole density
48、 Hole Diagram:hole pattern
49、 Drill Pattern:drill drawing
50、 Assembly drawings:assembly drawing
51、 Printed board assembly drawing:printed board assembly drawing
52、 Reference Baseline:datum referance