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Professional PCB Words English and Chinese

Professional PCB Words English and Chinese

 

一、综合词汇:


1
印制电路:printed circuit
2
印制线路:printed wiring
3
印制板:printed board
4
印制板电路:printed circuit board (pcb)
5
印制线路板:printed wiring board(pwb)
6
印制元件:printed component
7
印制接点:printed contact
8
印制板装配:printed board assembly
9
板:board
10
单面印制板:single-sided printed board(ssb)
11
双面印制板:double-sided printed board(dsb)
12
多层印制板:mulitlayer printed board(mlb)
13
多层印制电路板:mulitlayer printed circuit board
14
多层印制线路板:mulitlayer prited wiring board
15
刚性印制板:rigid printed board
16
刚性单面印制板:rigid single-sided printed borad
17
刚性双面印制板:rigid double-sided printed borad
18
刚性多层印制板:rigid multilayer printed board
19
挠性多层印制板:flexible multilayer printed board
20
挠性印制板:flexible printed board
21
挠性单面印制板:flexible single-sided printed board
22
挠性双面印制板:flexible double-sided printed board
23
挠性印制电路:flexible printed circuit (fpc)
24
挠性印制线路:flexible printed wiring
25
刚性印制板:flex-rigid printed board, rigid-flex printed board
26
刚性双面印制板:flex-rigid double-sided printed board, rigid-flex double-sided printed
27
刚性多层印制板:flex-rigid multilayer printed board, rigid-flex multilayer printed board
28
齐平印制板:flush printed board
29
金属芯印制板:metal core printed board
30
金属基印制板:metal base printed board
31
多重布线印制板:mulit-wiring printed board
32
陶瓷印制板:ceramic substrate printed board
33
导电胶印制板:electroconductive paste printed board
34
模塑电路板:molded circuit board
35
模压印制板:stamped printed wiring board
36
顺序层压多层印制板:sequentially-laminated mulitlayer
37
散线印制板:discrete wiring board
38
微线印制板:micro wire board
39
积层印制板:buile-up printed board
40
积层多层印制板:build-up mulitlayer printed board (bum)
41
积层挠印制板:build-up flexible printed board
42
表面层合电路板:surface laminar circuit (slc)
43
埋入凸块连印制板:b2it printed board
44
多层膜基板:multi-layered film substrate(mfs)
45
层间全内导通多层印制板:alivh multilayer printed board
46
载芯片板:chip on board (cob)
47
埋电阻板:buried resistance board
48
母板:mother board
49
子板:daughter board
50
背板:backplane
51
裸板:bare board
52
键盘板夹心板:copper-invar-copper board
53
动态挠性板:dynamic flex board
54
静态挠性板:static flex board
55
可断拼板:break-away planel
56
电缆:cable
57
挠性扁平电缆:flexible flat cable (ffc)
58
薄膜开关:membrane switch
59
混合电路:hybrid circuit
60
厚膜:thick film
61
厚膜电路:thick film circuit
62
薄膜:thin film
63
薄膜混合电路:thin film hybrid circuit
64
互连:interconnection
65
导线:conductor trace line
66
齐平导线:flush conductor
67
传输线:transmission line
68
跨交:crossover
69
板边插头:edge-board contact
70
增强板:stiffener
71
基底:substrate
72
基板面:real estate
73
导线面:conductor side
74
元件面:component side
75
焊接面:solder side
76
印制:printing
77
网格:grid
78
图形:pattern
79
导电图形:conductive pattern
80
非导电图形:non-conductive pattern
81
字符:legend
82
标志:mark


二、 PCB基材:

1 基材:base material
2
层压板:laminate
3
覆金属箔基材:metal-clad bade material
4
覆铜箔层压板:copper-clad laminate (ccl)
5
单面覆铜箔层压板:single-sided copper-clad laminate
6
双面覆铜箔层压板:double-sided copper-clad laminate
7
复合层压板:composite laminate
8
薄层压板:thin laminate
9
金属芯覆铜箔层压板:metal core copper-clad laminate
10
金属基覆铜层压板:metal base copper-clad laminate
11
挠性覆铜箔绝缘薄膜:flexible copper-clad dielectric film
12
基体材料:basis material
13
预浸材料:prepreg
14
粘结片:bonding sheet
15
预浸粘结片:preimpregnated bonding sheer
16
环氧玻璃基板:epoxy glass substrate
17
加成法用层压板:laminate for additive process
18
预制内层覆箔板:mass lamination panel
19
内层芯板:core material
20
催化板材:catalyzed board ,coated catalyzed laminate
21
涂胶催化层压板:adhesive-coated catalyzed laminate
22
涂胶无催层压板:adhesive-coated uncatalyzed laminate
23
粘结层:bonding layer
24
粘结膜:film adhesive
25
涂胶粘剂绝缘薄膜:adhesive coated dielectric film
26
无支撑胶粘剂膜:unsupported adhesive film
27
覆盖层:cover layer (cover lay)
28
增强板材:stiffener material
29
铜箔面:copper-clad surface
30
去铜箔面:foil removal surface
31
层压板面:unclad laminate surface
32
基膜面:base film surface
33
胶粘剂面:adhesive faec
34
原始光洁面:plate finish
35
粗面:matt finish
36
纵向:length wise direction
37
模向:cross wise direction
38
剪切板:cut to size panel
39
酚醛纸质覆铜箔板:phenolic cellulose paper copper-clad laminates(phenolic/paper ccl)
40
环氧纸质覆铜箔板:epoxide cellulose paper copper-clad laminates (epoxy/paper ccl)
41
环氧玻璃布基覆铜箔板:epoxide woven glass fabric copper-clad laminates
42
环氧玻璃布纸复合覆铜箔板:epoxide cellulose paper core, glass cloth surfaces copper-clad laminates
43
环氧玻璃布玻璃纤维复合覆铜箔板:epoxide non woven/woven glass reinforced copper-clad laminates
44
聚酯玻璃布覆铜箔板:ployester woven glass fabric copper-clad laminates
45
聚酰亚胺玻璃布覆铜箔板:polyimide woven glass fabric copper-clad laminates
46
双马来酰亚胺三嗪环氧玻璃布覆铜箔板:bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates
47
环氧合成纤维布覆铜箔板:epoxide synthetic fiber fabric copper-clad laminates
48
聚四乙烯玻璃纤维覆铜箔板:teflon/fiber glass copper-clad laminates
49
超薄型层压板:ultra thin laminate
50
陶瓷基覆铜箔板:ceramics base copper-clad laminates
51
紫外线阻挡型覆铜箔板:uv blocking copper-clad laminates


三、 PCB基材的材料

1 a阶树脂:a-stage resin
2
b阶树脂:b-stage resin
3
c阶树脂:c-stage resin
4
环氧树脂:epoxy resin
5
酚醛树脂:phenolic resin
6
聚酯树脂:polyester resin
7
聚酰亚胺树脂:polyimide resin
8
双马来酰亚胺三嗪树脂:bismaleimide-triazine resin
9
丙烯酸树脂:acrylic resin
10
三聚氰胺甲醛树脂:melamine formaldehyde resin
11
多官能环氧树脂:polyfunctional epoxy resin
12
溴化环氧树脂:brominated epoxy resin
13
环氧酚醛:epoxy novolac
14
氟树脂:fluroresin
15
硅树脂:silicone resin
16
硅烷:silane
17
聚合物:polymer
18
无定形聚合物:amorphous polymer
19
结晶现象:crystalline polamer
20
双晶现象:dimorphism
21
共聚物:copolymer
22
合成树脂:synthetic
23
热固性树脂:thermosetting resin
24
热塑性树脂:thermoplastic resin
25
感光性树脂:photosensitive resin
26
环氧当量:weight per epoxy equivalent (wpe)
27
环氧值:epoxy value
28
双氰胺:dicyandiamide
29
粘结剂:binder
30
胶粘剂:adesive
31
固化剂:curing agent
32
阻燃剂:flame retardant
33
遮光剂:opaquer
34
增塑剂:plasticizers
35
不饱和聚酯:unsatuiated polyester
36
聚酯薄膜:polyester
37
聚酰亚胺薄膜:polyimide film (pi)
38
聚四氟乙烯:polytetrafluoetylene (ptfe)
39
聚全氟乙烯丙烯薄膜:perfluorinated ethylene-propylene copolymer film (fep)
40
增强材料:reinforcing material
41
玻璃纤维:glass fiber
42
e玻璃纤维:e-glass fibre
43
d玻璃纤维:d-glass fibre
44
s玻璃纤维:s-glass fibre
45
玻璃布:glass fabric
46
非织布:non-woven fabric
47
玻璃纤维垫:glass mats
48
纱线:yarn
49
单丝:filament
50
绞股:strand
51
纬纱:weft yarn
52
经纱:warp yarn
53
但尼尔:denier
54
经向:warp-wise
55
纬向:weft-wise, filling-wise
56
织物经纬密度:thread count
57
织物组织:weave structure
58
平纹组织:plain structure
59
坏布:grey fabric
60
稀松织物:woven scrim
61
弓纬:bow of weave
62
断经:end missing
63
缺纬:mis-picks
64
纬斜:bias
65
折痕:crease
66
云织:waviness
67
鱼眼:fish eye
68
毛圈长:feather length
69
厚薄段:mark
70
裂缝:split
71
捻度:twist of yarn
72
浸润剂含量:size content
73
浸润剂残留量:size residue
74
处理剂含量:finish level
75
浸润剂:size
76
偶联剂:couplint agent
77
处理织物:finished fabric
78
聚酰胺纤维:polyarmide fiber
79
聚酯纤维非织布:non-woven polyester fabric
80
浸渍绝缘纵纸:impregnating insulation paper
81
聚芳酰胺纤维纸:aromatic polyamide paper
82
断裂长:breaking length
83
吸水高度:height of capillary rise
84
湿强度保留率:wet strength retention
85
白度:whitenness
86
陶瓷:ceramics
87
导电箔:conductive foil
88
铜箔:copper foil
89
电解铜箔:electrodeposited copper foil (ed copper foil)
90
压延铜箔:rolled copper foil
91
退火铜箔:annealed copper foil
92
压延退火铜箔:rolled annealed copper foil (ra copper foil)
93
薄铜箔:thin copper foil
94
涂胶铜箔:adhesive coated foil
95
涂胶脂铜箔:resin coated copper foil (rcc)
96
复合金属箔:composite metallic material
97
载体箔:carrier foil
98
殷瓦:invar
99
箔(剖面)轮廓:foil profile
100
光面:shiny side
101
粗糙面:matte side
102
处理面:treated side
103
防锈处理:stain proofing
104
双面处理铜箔:double treated foil


四、 PCB设计

1 原理图:shematic diagram
2
逻辑图:logic diagram
3
印制线路布设:printed wire layout
4
布设总图:master drawing
5
可制造性设计:design-for-manufacturability
6
计算机辅助设计:computer-aided design.(cad)
7
计算机辅助制造:computer-aided manufacturing.(cam)
8
计算机集成制造:computer integrat manufacturing.(cim)
9
计算机辅助工程:computer-aided engineering.(cae)
10
计算机辅助测试:computer-aided test.(cat)
11
电子设计自动化:electric design automation .(eda)
12
工程设计自动化:engineering design automaton .(eda2)
13
组装设计自动化:assembly aided architectural design. (aaad)
14
计算机辅助制图:computer aided drawing
15
计算机控制显示:computer controlled display .(ccd)
16
布局:placement
17
布线:routing
18
布图设计:layout
19
重布:rerouting
20
模拟:simulation
21
逻辑模拟:logic simulation
22
电路模拟:circit simulation
23
时序模拟:timing simulation
24
模块化:modularization
25
布线完成率:layout effeciency
26
机器描述格式:machine des criptionm format .(mdf)
27
机器描述格式数据库:mdf databse
28
设计数据库:design database
29
设计原点:design origin
30
优化(设计):optimization (design)
31
供设计优化坐标轴:predominant axis
32
表格原点:table origin
33
镜像:mirroring
34
驱动文件:drive file
35
中间文件:intermediate file
36
制造文件:manufacturing documentation
37
队列支撑数据库:queue support database
38
元件安置:component positioning
39
图形显示:graphics dispaly
40
比例因子:scaling factor
41
扫描填充:scan filling
42
矩形填充:rectangle filling
43
填充域:region filling
44
实体设计:physical design
45
逻辑设计:logic design
46
逻辑电路:logic circuit
47
层次设计:hierarchical design
48
自顶向下设计:top-down design
49
自底向上设计:bottom-up design
50
线网:net
51
数字化:digitzing
52
设计规则检查:design rule checking
53
走(布)线器:router (cad)
54
网络表:net list
55
计算机辅助电路分析:computer-aided circuit analysis
56
子线网:subnet
57
目标函数:objective function
58
设计后处理:post design processing (pdp)
59
交互式制图设计:interactive drawing design
60
费用矩阵:cost metrix
61
工程图:engineering drawing
62
方块框图:block diagram
63
迷宫:moze
64
元件密度:component density
65
巡回售货员问题:traveling salesman problem
66
自由度:degrees freedom
67
入度:out going degree
68
出度:incoming degree
69
曼哈顿距离:manhatton distance
70
欧几里德距离:euclidean distance
71
网络:network
72
阵列:array
73
段:segment
74
逻辑:logic
75
逻辑设计自动化:logic design automation
76
分线:separated time
77
分层:separated layer
78
定顺序:definite sequence


五、 形状与尺寸:

1 导线(通道):conduction (track)
2
导线(体)宽度:conductor width
3
导线距离:conductor spacing
4
导线层:conductor layer
5
导线宽度/间距:conductor line/space
6
第一导线层:conductor layer no.1
7
圆形盘:round pad
8
方形盘:square pad
9
菱形盘:diamond pad
10
长方形焊盘:oblong pad
11
子弹形盘:bullet pad
12
泪滴盘:teardrop pad
13
雪人盘:snowman pad
14
v形盘:v-shaped pad
15
环形盘:annular pad
16
非圆形盘:non-circular pad
17
隔离盘:isolation pad
18
非功能连接盘:monfunctional pad
19
偏置连接盘:offset land
20
腹(背)裸盘:back-bard land
21
盘址:anchoring spaur
22
连接盘图形:land pattern
23
连接盘网格阵列:land grid array
24
孔环:annular ring
25
元件孔:component hole
26
安装孔:mounting hole
27
支撑孔:supported hole
28
非支撑孔:unsupported hole
29
导通孔:via
30
镀通孔:plated through hole (pth)
31
余隙孔:access hole
32
盲孔:blind via (hole)
33
埋孔:buried via hole
34
/盲孔:buried /blind via
35
任意层内部导通孔:any layer inner via hole (alivh)
36
全部钻孔:all drilled hole
37
定位孔:toaling hole
38
无连接盘孔:landless hole
39
中间孔:interstitial hole
40
无连接盘导通孔:landless via hole
41
引导孔:pilot hole
42
端接全隙孔:terminal clearomee hole
43
准表面间镀覆孔:quasi-interfacing plated-through hole
44
准尺寸孔:dimensioned hole
45
在连接盘中导通孔:via-in-pad
46
孔位:hole location
47
孔密度:hole density
48
孔图:hole pattern
49
钻孔图:drill drawing
50
装配图:assembly drawing
51
印制板组装图:printed board assembly drawing
52
参考基准:datum referance


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