PCB fabrication

10 Layer High Performance High TG Fr4 Lead Free ENIG PCB Fabrication

Specification:

Lead free compatible FR4 Laminate

TG170 ℃，UV Blocking/AOI compatible

High heat resistance

Lower Z-axis CTE

Excellent through-hole reliability

Excellent anti-CAF performance

Low water absorption

Excellent mechanical processibility

Basic information:

Layer:10

Surface finish: ENIG

Thickness:1mm

Copper weight:1OZ

Stack up: 2 core

6 Layer Multilayer PCB parameter:

Number of Layer	10 Layer
Order Quantity	1 to 50,000
Board Shape	Retangular,round,slots,cutouts,complex,irregular
Board Type	Rigid, Flexible, Rigid-flexible
Board Material	FR-4 glass epoxy, FR-4 high Tg, Rohs compliant,Aluminum,Rogers,etc.
Board Cutting	Shear,V-score,Tab-routed
Board Thickness	0.2-4.0mm, Flex 0.01-0.25mm
Copper Weight	1.0, 1.5, 2.0 ,3.0,4OZ
Solder Mask	Double-sided green LPI,Also support Red,White,Yellow,Blue,Black
Silk Screen	Double-sided or single-sided in white,yellow,black,or negative
Silk Screen Min Line Width	0.006'' or 0.15mm
Max Board Dimensions	20 inch20inch or 500mm500mm
Min Trace/Gap	0.10mm, or 4mils
Min Drill Hole Diameter	0.01'',0.25mm, or 10mils
Surface Finish	HASL,Nickle,Immersion Gold,Immersion Tin,Immersion Silver,OSP,etc.
Board Thickness Tolerance	±10%
Copper Weight Tolerance	± 0.25 oz
Minimal Slot Width	0.12'', 3.0mm, or 120mils
V-Score Depth	20-25% of board thickness
Design File Formate	Gerber RS-274,274D,Eagle and AutoCAD's DXF,DWG