12 Layer Multilayer PCB Stack up Circuit Boards For Medical Equipment

Layer

12

Min   hole

0.15mm

Surface   finish

HASL   lf

Stack   up file

yes

Copper  

2OZ

Blind   hole

yes

Thickness

1.25MM

Quantity

prototype

Surface Treatment

HASL(LF)

HASL(LF)

Immersion Gold

Immersion Gold

Flash Gold

Flash Gold

OSP

OSP

Immersion Tin

Immersion Tin

Immersion Silver

Immersion Silver

HASL&Gold Finger

HASL&Gold Finger

selective nickel

selective nickel

HASL(LF)

smt Pad:>3um

smt Pad:>4um

Big Cu:>lum

Big Cu:>l.5um

Immersion Tin

0.4-0.8um

0.8-1.2um

Immersion Gold

Ni:2-5urn

Ni:3-6urn

Au:0.05-0.10um

Au:0.075-0.15um

Immersion Silver

0.2-0.6um

0.3-0.6um

OSP

0.1-0.4um

0.25-0.4um

Flash Gold

Ni:3-6urn

Ni:3-6urn

Au:0.01-0.05um

Au:0.02-0.075um

Laminates

CEM-3,PTFE

CEM-3,PTFE

FR4 (HighTG etc)

FR4(HighTG etc)

Metal Base(AL,CUetc)

Metal Base(AL,CUetc)

Rogers,etc

Rogers,etc

MAX.Layers

18(Layers)

40(Layers)

MAX.Board Size

20"X48"

20"X48"

Board Thickness

O.4mm~6.0mm

<O.4mm or >8.0mm

Max.Copper Thickness

inner Layer:16oz

inner Layer:16oz

Outer Layer:16oz

Outer Layer:16oz

Min.Track Width

3mil/0.075mm

3mil/0.075mm

Min.Track Space

3mil/0.075mm

3mil/0.075mm

M.in Hole Size

8mil/0.2mm

6mil/0.1mm

M.in Laser Hole Size

4mil/0.1mm

3mil/0.076mm

PTH Wall Thickness

0.8mil/20um

1.2mil/30um

PTH Dia.Tolerance

±2mil/±50um

±2mil/±50um

Aspect Ratio

12:1

15:1

lmpedance Control

±5%

±5%