PCB fabrication

  • Custom FR4 Material Multilayer 4 Layer Half Hole Bluetooth PCB Board
Custom FR4 Material Multilayer 4 Layer Half Hole Bluetooth PCB Board

Custom FR4 Material Multilayer 4 Layer Half Hole Bluetooth PCB Board

Custom FR4 Material Multilayer 4 Layer Half Hole Bluetooth PCB Board

 

Manufacturing

Multi layered pcb,  Multilayer pcb manufacturing

Specification:

Model: ONESEINE

Origin: China

Min line space: 10mil

Min line width: 10 mil

Board size: 2.8*1 cm

Layer: 4

Board thickness: 1.2mm

Copper foil: 35UM

Material: FR4

 

Parameter:

Technology

 Capabilities

 Capabilities

Max.Layer   Count

  30 Layers

  30 Layers

Max.Panel Size

  27.5"x24"

  27.5"x24"

Max.Board   Thickness

  3.5mm

  5.8mm

Outer Layer

  3.5/3.5mils

  3/3mils

Inner Layer

  3.5/3.5mils

  3/3mils

Min.Board   Thickness

  2L:6mils

  2L:6mils


  4L:15mils

  4L:15mils


  6L:23mils

  6L:23mils

Min.SMT/BGA   Pitch

  12mils   for SMT

  12mils   for SMT


  24mils   for BGA

  20mils   for BGA

Min.Drill   Size&Aspect Ratio

  0.2mm   Drill for 0.8mm   Thickness(4.0:1)

  0.2mm   Drill for 0.8mm
    Thickness(4.0:1)


  0.25mm   Drill for 1.6mm
    Thickness(6.4:1)

  0.25mm   Drill for 1.6mm
    Thickness(6.4:1)


  0.30mm   Drill for 2.4mm
    Thickness(8.0:1)

  0.30mm   Drill for 2.4mm
    Thickness(8.0:1)

Surface   Finishes

  HASL

  HASL


  Selective   Immersion Tin

  Selective   Immersion  Tin


  Immersion   Silver

  Immersion   Silver


  Immersion   Gold

  Immersion   Gold


  Hard   Gold

  Hard   Gold


  OSP

  OSP


  Gold   finger

  Gold   finger

Controlled   Impedance

  +/-   10%

  +/-7%

Contouring

  Routing,   V-Groove,

  Routing,   V-Groove,


  Beveling   Punch

  Beveling   Punch

Hole Diameter

  +/-   2 mil

  +/-   2 mil

Min.S/M   Thickness

  0.4   mil

  0.6   mil


Categories

Contact Us

Contact: Flexible PCB

Phone: 0086 18682010757

E-mail: kico@oneseine.com

Add: B area,101 Buliding,No12,Fushan 2th Road,Doumen,Zhuhai,China