Custom FR4 Material Multilayer 4 Layer Half Hole Bluetooth PCB Board
Manufacturing
Multi layered pcb, Multilayer pcb manufacturing
Specification:
Model: ONESEINE
Origin: China
Min line space: 10mil
Min line width: 10 mil
Board size: 2.8*1 cm
Layer: 4
Board thickness: 1.2mm
Copper foil: 35UM
Material: FR4
Parameter:
Technology | Capabilities | Capabilities |
Max.Layer Count | 30 Layers | 30 Layers |
Max.Panel Size | 27.5"x24" | 27.5"x24" |
Max.Board Thickness | 3.5mm | 5.8mm |
Outer Layer | 3.5/3.5mils | 3/3mils |
Inner Layer | 3.5/3.5mils | 3/3mils |
Min.Board Thickness | 2L:6mils | 2L:6mils |
4L:15mils | 4L:15mils | |
6L:23mils | 6L:23mils | |
Min.SMT/BGA Pitch | 12mils for SMT | 12mils for SMT |
24mils for BGA | 20mils for BGA | |
Min.Drill Size&Aspect Ratio | 0.2mm Drill for 0.8mm Thickness(4.0:1) | 0.2mm Drill for 0.8mm |
0.25mm Drill for 1.6mm | 0.25mm Drill for 1.6mm | |
0.30mm Drill for 2.4mm | 0.30mm Drill for 2.4mm | |
Surface Finishes | HASL | HASL |
Selective Immersion Tin | Selective Immersion Tin | |
Immersion Silver | Immersion Silver | |
Immersion Gold | Immersion Gold | |
Hard Gold | Hard Gold | |
OSP | OSP | |
Gold finger | Gold finger | |
Controlled Impedance | +/- 10% | +/-7% |
Contouring | Routing, V-Groove, | Routing, V-Groove, |
Beveling Punch | Beveling Punch | |
Hole Diameter | +/- 2 mil | +/- 2 mil |
Min.S/M Thickness | 0.4 mil | 0.6 mil |
Contact: Flexible PCB
Phone: 0086 18682010757
E-mail: kico@oneseine.com
Add: B area,101 Buliding,No12,Fushan 2th Road,Doumen,Zhuhai,China