Custom FR4 Material Multilayer 4 Layer Half Hole Bluetooth PCB Board

Max.Layer   Count

  30 Layers

  30 Layers

Max.Panel Size

  27.5"x24"

  27.5"x24"

Max.Board   Thickness

  3.5mm

  5.8mm

Outer Layer

  3.5/3.5mils

  3/3mils

Inner Layer

  3.5/3.5mils

  3/3mils

Min.Board   Thickness

  2L:6mils

  2L:6mils

  4L:15mils

  4L:15mils

  6L:23mils

  6L:23mils

Min.SMT/BGA   Pitch

  12mils   for SMT

  12mils   for SMT

  24mils   for BGA

  20mils   for BGA

Min.Drill   Size&Aspect Ratio

  0.2mm   Drill for 0.8mm   Thickness(4.0:1)

  0.2mm   Drill for 0.8mm
    Thickness(4.0:1)

  0.25mm   Drill for 1.6mm
    Thickness(6.4:1)

  0.25mm   Drill for 1.6mm
    Thickness(6.4:1)

  0.30mm   Drill for 2.4mm
    Thickness(8.0:1)

  0.30mm   Drill for 2.4mm
    Thickness(8.0:1)

Surface   Finishes

  HASL

  HASL

  Selective   Immersion Tin

  Selective   Immersion  Tin

  Immersion   Silver

  Immersion   Silver

  Immersion   Gold

  Immersion   Gold

  Hard   Gold

  Hard   Gold

  OSP

  OSP

  Gold   finger

  Gold   finger

Controlled   Impedance

  +/-   10%

  +/-7%

Contouring

  Routing,   V-Groove,

  Routing,   V-Groove,

  Beveling   Punch

  Beveling   Punch

Hole Diameter

  +/-   2 mil

  +/-   2 mil

Min.S/M   Thickness

  0.4   mil

  0.6   mil