Satellite Communications Blind Buried Hole PCB Printed Circuit Board Design For Satcom Industry

Satellite Communications Blind Buried Hole PCB Printed Circuit Board Design For Satcom Industry

Quick detail:

Board size: 23*12 cm                                             

Board thickness: 0.2mm

Copper foil: 3OZ

Layer: 6

High frequency PCBs with aluminum heat sink for telecommunication and aerospace industries using customer specific electrically and thermally conductive bonding films. Microwave PCB’s: ONESEINE has enormous experience and technical expertise in the manufacturing of time critical, high technology RF circuits. The company works closely with its worldwide customers to deliver prototype-to-large volume manufacturing of circuits. During this process our engineering staff discusses with the customers’ staff to come up with the optimized designs for high quality, low cost and speedy delivery.

Some Typical Applications:

• Automotive radar applications

• Global positioning satellite

antennas

• Cellular telecommunications

systems - power amplifi ers and

antennas

• Patch antenna for wireless

communications

• Direct broadcast satellites

• Datalink on cable systems

• Remote meter readers

Features:

1. Rogers pcb multilayer pcb with high frequency can improvide the products quality ,with high techolonogy treatment improve the life cycle of the products .

2. Immersion gold surface finish make the pcb 's conductive performance enhancements.

3. Multilayer pcb design ,the precision of the pcb improves much more better .

4. Low dielectric : 3 dielectric conductivity much more precision .

Description :

RT/duroid® 6006 microwave laminates are ceramic-PTFE composites designed for electronic and microwave circuit applications requiring a high dielectric constant. RT/duroid 6006 laminate is available with a dielectric constant value of 6.15 and RT/duroid 6010LM laminate has a dielectric constant of 10.2.

RT/duroid 6006 microwave laminates feature ease of fabrication and stability in use. They have tight dielectric constant and thickness control, low moisture absorption, and good thermal mechanical stability.

RT/duroid 6006 laminates are supplied clad both sides with ¼ oz. to 2 oz./ft2 (8.5 to 70 μm) electrodeposited copper foil. Cladding with rolled copper foil is also available. Thick aluminum, brass, or copper plate on one side may be specifi ed.

Key Benefits:

·         High dielectric constant for circuit size reduction

·         Low loss. Ideal for operating at X-band or below

·         Tight εr and thickness control for repeatable circuit performance

Typical Applications:

·         Space Saving Circuitry

·         Patch Antennas

·         Satellite Communications Systems

·         Power Amplifiers

·         Aircraft Collision Avoidance Systems

·         Ground Radar Warning Systems