Multilayer BGA HDI pcb fabrication and assembly

Multilayer BGA HDI pcb fabrication and assembly

Basic information:

Model number:ONE-A

Layer:6

Material:Rogers+fr4

Surface finish:HASL lead free

Copper weight:1OZ

Board thickness:1.5mm

HS Code: 8534001000

Application: Communication

PCB Design Services: Yes

Prototypes Run: Yes

Our Multilayer PCB and PCBA capability and services:

SMT/THT/DIP.

1. Component Purchasing Service

2. SMT assembly and Through hole components insertion

3. IC pre-programming / Burning on-line

4. Function testing as requested

5. Complete Unit assembly (which including plastics, metal box, Coil, cable inside etc)

6. Packing design

Multilayer PCB assembly OEM & ODM Orders are Welcome.

We have in-house workshop for one stop shop service

OEM (We manufacture according to your design - BOM, Gerber file and testing procedures, while providing you best recommendations for easy manufacturing and cost saving):

1. Component sourcing and procurement

2. PCB Manufacturing

3. Component Assembly (PCBA - SMT & Through Hole parts)

4. Chip-on-board (COB)

Surface-mount technology (SMT)

Ball-grid array (BGA)

Through-hole

5. Plastic Enclosure (Mould) Manufacturing

6. Metal Enclosure (Tool) Manufacturing

7. Cable & Wire harness Assembly

8. Final Assembly

9. QC Testing

10.Packaging