Rogers4350 FR4 Mixed Dielectric Hybrid stack-up PCB Prototype with Low cost

General info.:

Base material: rogers 4350 0.203mm+fr4

Layer:4

Surface finish:Immersion gold

Board size: 15.9*8.5cm

Final board thickness:1.5mm

Min trace width:0.2mm

Solder mask and silk: Yes

Stack up file:

Prototype time:8-10 days

4layers with 3 cores,calculate as 8layers.fake 8layer

Mixed high frequency construction can reduce costs when the need for RF dielectric is local and only between some layers. The rest of the dielectric can be FR4 or halogen-free FR4. It is also possible to combine PTFE (Teflon) materials with FR4.

Cross section of mixed Rogers 4350B, high Tg FR4 and embedded C-coin: