PCB fabrication

DK2.2 Arlon 880 HF PCB Printed Circuit Board Fabrication

INQUIRY

General Information:

Name:HF high frequency pcb board

Dielectric constant:2.2(alternative material:TLY-5,RT5880,NY9220)

Material:Arlon 880 1.524mm

Layer:2

Surface finish:ENIG

Copper weight:1OZ

Finished board thickness:1.6mm

PCB thickness tolerance：+-0.1MM

Type: PCB prototype

Board size:12*15cm

Quantity:15 pcs

Delivery time: 7 days

HF PCB Application:

• Military Radar Feed Networks

• Commercial Phased Array Networks

• Low Loss Base Station Antennas

• Missile Guidance Systems

• Digital Radio Antennas

• Filters, Couplers, LNAs

HF Material Selection:

Brand	Model	Thickness（mm)	DK(ER)
Rogers	RO4003	0.203, 0.5、0.813、1.524	3.38
	RO4350	0.168,0.254 0.508、0.762、1.524	3.5
	RO4360G2	0.61,1.524	6.15
	RT5880	0.254.0.508.0.787	2.2
	RO3003	0.127，0.254,0.508，0.762，1.524	3
	RO3010	0.635	10.2
	RO3006	0.254	6.15
	RO3206	0.635MM	10.2
	R03035	0.508MM	3.5
	RT6010	0.635MM, 1,27MM	10.2
TACONIC	TLX-8.TLX-9	0.508. 0.762	2.45-2.65
	TLC-32	0.254、0.508,0.762	3.35
	TLY-5	0.254、0.508.0.8、	2.2
	RF-60A	0.254.0.508.0.762	6.15
	CER-10	0.254.0.508.0.762	10
	RF-30	0.254.0.508.0.762	3
	TLA-35	0.8	3.2
ARLON	AD255C06099C	1.5	2.55
	MCG0300CG	0.8	3.7
	AD0300C	0.8	3
	AD255C03099C	0.8	2.55
	AD255C04099C	1	2.55
	Diclad880	0.762,1.524mm	2.2
	DLC220	1	2.2
F4B	F4B	0.38	2.2
	F4B	0.55	2.23
	F4B	0.225、0.3、0.5、08、1、1.2、1.5、2、2.5、3.0	2.65
	F4Bk	0.8、1.5	2.65
	F4B	0.8	3.5
	FE=F4BM	1	2.2

The basic characteristics of high-frequency PCB substrate materials:

1, the dielectric constant (Dk) must be small and very stable, usually the smaller the better signal transmission rate and the material is inversely proportional to the square root of the dielectric constant, high dielectric constant susceptible to signal transmission delay.

2,Dielectric loss (Df) must be small, which mainly affects the quality of signal transmission, the smaller the dielectric loss so that the signal loss is also smaller.

3,And in accordance with copper foil thermal expansion coefficient as far as possible, because inconsistencies in the change in the cold and heat caused by copper foil separation.

4,Water absorption is low, high water absorption will affect the dielectric constant when the damp and dielectric loss.

5,Other heat resistance, chemical resistance, impact strength, peel strength, etc. must also be good.

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