High Frequency Multi layer PCB Manufacturer Fabrication Printed Circuit Board Layout

High Frequency Multi layer PCB Manufacturer Fabrication Printed Circuit Board Layout

Basic information:

ONESEINE Multi layer pcb fabrication:

Cut raw material

Inner layer dry film

Black oxidation

Stack up(pressing)

1, composing

2,stack up procedure

machine drilling

chemically deposited with a copper

Dry film and pattern plating

Wet film solder mask

Silk screen printing

Profiling

E-Test

Final inspection

Package

Alternating layers of prepeg and core materials are laminated together under high temperature and pressure to produce Multilayer PCBs. This process ensures that air isn't trapped between layers, conductors are completely encapsulated by resin, and the adhesive that holds the layers together are properly melted and cured. The range of material combinations is extensive from basic epoxy glass to exotic ceramic or Teflon materials. 

Multi layer PCB is a circuit board that has more than two layers.

Unlike a Double-Sided PCB which only has two conductive layers of material, all multilayer PCBs must have at least three layers of conductive material which are buried in the center of the material.

Applications of Multi layer PCB

While the weight and space benefits of multilayer PCBs are especially valuable for Aerospace PCBs, multilayer PCBs are also beneficial to applications where "cross-talk" levels are critical. These are a few other the applications using multilayer printed circuit boards:

Computers

File servers

Data storage

Signal transmission

Cell phone transmission

Cell phone repeaters

GPS technology

Industrial controls

Satellite systems

Hand held devices

Test equipment

X-ray equipment

Heart monitors

Cat scan technology

Atomic accelerators

Central fire alarm systems

Fiber optic receptors

Nuclear detection systems

Space probe equipment

Weather analysis