Rogers 4360 1.524MM ENIG Rigid PCB Circuit Boards Fabrication
Quick detail:
Material | Rogers4360G2 | Layer | 2 |
Thickness | 1.8mm | DK | 6.15 |
Surface finish | ENIG | Df | 0.0038 |
Copper weight | 1OZ | Thermal Conductivity | 0.75 |
Features and benefits:
RO4000 thermoset resin system
specially formulated to meet 6.15 Dk
• Ease of fabrication / processes
similar to FR-4
• RO4000 material repeatability
• Low loss
• High thermal conductivity
• Lower total PCB cost solution
than competing PTFE products
Low Z-axis CTE / High Tg
• Design fl exibility
• Plated through-hole reliability
• Automated assembly compatible
Environmentally friendly
• Lead free process compatible
Regional fi nished goods inventory
• Short lead times / quick inventory
turns
• Efficient supply chain
Rogers4360G2 information:
RO4360G2 laminates are 6.15 Dk, low loss, glass-reinforced,hydrocarbon ceramic-fi lled thermoset materials that provide the idealbalance of performance and processing ease. RO4360G2 laminates extend Rogers’ portfolio of high performance materials by providing
customers with a product that is lead-free process capable and offers better rigidity for improved processability in multi-layer board constructions, while reducing material and fabrication costs.
RO4360G2 laminates process similar to FR-4 and are automated assembly compatible. They have a low
Z-axis CTE for design fl exibility and have the same high Tg as all of the RO4000 product line.
RO4360G2 laminates can be paired with RO4400 prepreg and lower-Dk RO4000 laminate in multi-layer designs.
Contact: Flexible PCB
Phone: 0086 18682010757
E-mail: kico@oneseine.com
Add: B area,101 Buliding,No12,Fushan 2th Road,Doumen,Zhuhai,China