multilayer pcb fabrication process

multilayer pcb fabrication process

About the multilayer PCB manufacturing process, normally the PCB manufacturer should make inner core layer image first, and then press the inner core together with high temperature and pressure by pressing machine, the manufacturing process for outer layers is similar with double-sided PCB, below flow chart describe the detailed manufacturing process for multilayer PCB.

The multilayer PCB is the development of the double sided PCB. With increasing complexity and density of components many designers were struggling to find the route and size required for modern instruments. Adding just a power and ground plane to the inside of the board allowed the components to be powered with just two plated holes to the inner layers rather than a track back to a power/ground point. Once the technology to multilayer PCBs was established, it was further developed to have additional signal layers inside. This allowed the designers to produce highly complex and compact circuits and further development of blind and buried via hole technology has pushed these limits even further. The highly complex PCBs now being offered allow high density packaging to the designer’s requirement and in line with the most complex components.