PCB fabrication

Nelco Material PCB HF Substrate Circuit Boards

PCB specification:

Nelco RF and Microwave Materials

Nelco NY9220/4000 PCB Printed Circuit Boards

A complete spectrum of reliable, high-value substrates for commercial

and military critical microwave components, antennas and subassemblies.

NY9000 series - PTFE/woven-glass composite. Low glass to PTFE ratio

NX9000 series - PTFE/woven-glass composite. High glass to PTFE ratio

NH9000 series - PTFE/woven-glass/ceramic composite. Medium glass to PTFE ratio

N4350-13 RF - controlled Dk/Df modified epoxy

N4380-13 RF - controlled Dk/Df modified epoxy

N9000-13 RF - PTFE and epoxy composite

Applications:

automotive

wireless handsets and infrastructure

hybrid RF multilayers

communications and networking

power amplifiers

802.11 a, b and g antennas

Avionics

LNB

General Parameter:

Layer	12-26
Material type	FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers,Nelco
Board thickness	0.21mm to 7.0mm
Copper thickness	0.5 OZ to 6 oz
Size	Max. Board Size: 580mm×1100mm
	Min. Drilled Hole Size: 0.2 mm (8 mil)
	Min. Line Width: 4mil (0.1mm)
	Min. Line Spacing: 4mil (0.1mm)
Surface finishing	HASL / HASL lead free, HAL, Chemical tin, Immersion Silver/Gold, OSP, Gold plating
Solder Mask Color	Green/Yellow/Black/White/Red/Blue
Tolerance	Shape tolerance: ±0.13
Tolerance	Hole tolerance: PTH: ±0.076 NPTH: ±0.05
Certificate	UL, ISO 9001, ISO 14001
Special requirements	Buried and blind vias+controlled impedance +BGA
Profiling	Punching, Routing, V-CUT, Beveling