PCB fabrication

Fr4 Double Sided Blue Solder Mask Electronic minipad PCB

PCB basic technology:

Material:fr4

Layer:2

Surface finish:ENIG

Copper weight:1OZ

PCB thickness:1.6mm

Solder mask:Green color

Panel:3*2

Name:Minipad PCB printed circuit boards manufacturer in Shenzhen,China

Fr4 double sided pcb manufacturer:

Base material: CEM1 / CEM3 / FR4 / FR4 Lead-free / FR4 Halogen-free

Thickness: 0.2 to 3.2 mm

Design: 200/200µm line & space on 35µm copper. 75/100µm line & space on 12 µm copper (low volume)

Soldermask: UV cured or LDI

Carbon contacts

PCB dimensions: 588 x 510mm / 700 x 500 mm (low volume)

Contouring: Routing / Stamping

Metallic Finishes: HASL (lead-free) / HASL (tin-lead) / Immersion Silver / Immersion Tin / OSP / ENIG / Electrolytic NiAu

Product Range

2-20 layers high density impedance, blind/buried, HDI, high frequency, Halogen free, high TG, Alum,

Cu, and ceramic base PCB

ONESEINE PCB Technology

Layer number: 1-20 layers

Finished board thickness: 0.008’’~0.24’’ (0.2mm~6.0mm)

Min. drilling diameter: 6mil (0.15mm)

Min. trace width/space: 3-4 mil (0.076-0.10mm)

Max. board size: single, double sided 22’’x43’’ (550x1100mm) multilayer 22’’x25’’ (550x640mm)

Impedance control: ±10%

Surface finish: OSP, HAL, HAL lead free, electronic gold, ENIG, gold finger, immersion silver, immersion tin, thick gold plating

Base material: FR4 (Shengyi, KB, Intl.); High TG (TG150, TG170), Halogen free, Alum. Cu, Iron, ceramic base

Fr4 double sided pcb:

Double sided FR4 PCB with HASL

PCB Technical Capacity
Item		Production Capacity
1	Product	Double sided FR4 PCB with HASL
2	Layer Counts	1L-28L
3	Material	(1) CEM1，CEM3，FR-4 High TG FR4, Halogen-free FR4, Polyimide
		(2) aluminium, Ceramic(96%Alumina), Teflon PTFE(F4B,F4BK)
		(3) Rogers(4003.4350.5880) , Taconic(TLX-8.TLX-9), Arlon(35N.85N)
4	Material Mixed Laminate	FR4+Ro4350.FR4+Aluminium.FR4+FPC
5	Board Size	(1) Maximum Size	610mm*1200mm
		(2) Minimum Line/Space	0.10mm
		(3) Board Thickness	0.125mm--6.00mm
		(4) OutLayer Copper Thickness	17um-175um
		(5) InnerLayer Copper Thickness	17um-175um
		(6) Mini Solder Mask Bridge	0.05mm
6	Board Tolerance	(1) Board Outline Tolerance	±0.15mm
		(2) Thickness Tolerance	t≥0.8mm ±8%
		(2) Thickness Tolerance	t<0.8mm ±10%
		(3) Hole Position/hole Tolerance	±0.05mm PTH:±0.076mm NPTH:±0.05mm
		(4) Trace width Tolerance	15%-20%
7	Drilling	(1) Minimum Drilling Hole(Mechanical)	0.2mm
		(2) Minimum Laser hole	0.1mm
		(3) Mini hole ring(single)	0.075mm
8	Surface Finishing	HASL, Lead free HASL,Immersion gold, Immersion tin, Immersion Silver, Plated gold, OSP,Carbon ink
8	Surface Finishing
9	Acceptable File Format	ALL Gerber Files, CAM-350, PROTEL, PADS2000, CAD, ORCAD, P-CAD, CAM2000 ect
10	Quality Standards	SGS
11	Packing	Inner vacuum packing, outer standard carton box