22-Layer High-Density Impedance PCB Manufacturer | Nelco 4000-13EP + Mitsui MC24M Mixed Stackup

22-Layer High-Density Impedance PCB Manufacturer | Nelco 4000-13EP + Mitsui MC24M Mixed Stackup

As a professional high-layer-count multilayer PCB manufacturer, we specialize in custom 22-layer controlled impedance circuit boards built with high-performance Nelco high-speed materials. This 22-layer stackup design adopts a mixed dielectric configuration with Nelco 4000-13EP and Mitsui MC24M materials, delivering stable impedance control and excellent high-speed signal transmission performance for high-end complex electronic systems.

Core Product Specifications

Stackup structure: 22-layer multilayer PCB, with Nelco 4000-13EP (dielectric constant Er = 3.7) for most layers, and Mitsui MC24M high-speed material dedicated for layers 10–11 and 12–13

Solder mask: Brown LPI (Liquid Photoimageable Solder Mask)

Silkscreen overlay: White silkscreen for top and bottom layers

Surface finish: ENIG (Electroless Nickel Immersion Gold)

Minimum trace width: 3.15 mils, supporting fine-line high-density routing

Minimum via size: 16/8 mils (drill diameter / pad diameter)

Production file format: 4:4 resolution metric Gerber and NC drill files

Key Manufacturing & Performance Advantages

High-Speed Material Performance

The main stackup uses Nelco 4000-13EP high-speed epoxy laminate, which delivers stable dielectric constant, low signal loss and excellent impedance consistency, making it ideal for high-speed digital circuit designs. The dedicated Mitsui MC24M material for specific middle layers is optimized for targeted impedance and signal integrity requirements of critical high-speed signal paths.

Precision Controlled Impedance

We implement strict process control for trace width, dielectric thickness and copper weight across all 22 layers, ensuring impedance tolerance meets design requirements for high-speed signal transmission. The mixed-material stackup supports customized impedance targets for different signal groups across the board.

High-Density Routing Capability

3.15mil minimum trace width and 16/8mil minimum via size support high-density layout for complex 22-layer designs, enabling compact board size while accommodating large numbers of high-speed signal, power and ground networks.

Reliable ENIG Surface Finish

Immersion gold surface finish provides excellent solderability, flat pad surface and stable contact resistance, suitable for fine-pitch BGA, QFP and other high-density component assembly for high-end electronic products.

Typical Applications

22-layer high-density impedance controlled PCBs are widely used in high-performance electronic products including:

High-end server and data center core boards

5G communication infrastructure equipment

High-end industrial control mainboards

Medical imaging and high-precision testing equipment

Aerospace and defense electronic systems

Quality Assurance

All 22-layer multilayer PCBs undergo full-process quality control, including AOI inspection, impedance testing, 100% electrical open/short test and final appearance inspection, with full compliance with IPC-6012 Class 2/3 quality standards. We support fully customized stackup design, material selection and impedance specification matching based on customer design requirements.

SEO Keywords

22 Layer PCB Stackup, Nelco 4000-13EP PCB, High Layer Count Impedance PCB, Mitsui MC24M PCB, ENIG Multilayer PCB Manufacturer, High Density Multilayer PCB, Controlled Impedance PCB, 3.15mil Minimum Trace Width PCB, High Speed PCB Material, Mixed Dielectric PCB Stackup, 22 Layer Circuit Board, Nelco PCB Manufacturer, Fine Line High Density PCB, Industrial Control Multilayer PCB, IPC Class 3 Multilayer PCB