10-Layer ELIC Metal Edge PCB | IT180A FR4 Any Layer Interconnection Circuit Board (ENIG+OSP)

10-Layer ELIC Metal Edge PCB | IT180A FR4 Any Layer Interconnection Circuit Board (ENIG+OSP)

As a professional high-density PCB manufacturer, we supply custom 10-layer ELIC metal edge circuit boards built with IT180A high-speed FR4 substrate. This board features every-layer interconnection capability and side-wall metal plating, combining high routing density, reliable electrical performance and special structural features for high-end compact electronic designs.

Core Product Specifications

Layer count: 10-layer multilayer PCB with dedicated bonding prepreg layers

Substrate material: IT180A high-speed FR4, 1.0mm core thickness

Surface finish: Hybrid ENIG (Electroless Nickel Immersion Gold) + OSP (Organic Solderability Preservative)

Copper weight: 0.5OZ base copper thickness

Minimum trace width & spacing: 2.5mil fine-line routing capability

Special processes: ELIC any-layer interconnection + metal edge plating

Interconnection range: Full ELIC connectivity supporting via paths from layer 1 to any layer (1-2, 1-3, 1-4, 1-5, 1-6, 1-7, 1-8, 1-9, 1-10)

Via requirement: All vias are fully metal-plated to ensure reliable electrical connection

Edge requirement: Both side walls of the PCB are plated with continuous metal

Dimensional accuracy: All layer dimensions controlled within ±0.01mm Gerber tolerance for high fabrication precision

Key Special Process Features

1. ELIC (Every Layer Interconnection) Any Layer Interconnection

ELIC is an advanced high-density interconnect (HDI) process that enables vertical electrical connection between any two layers of the board, rather than being limited to adjacent layers. This 10-layer design supports full interconnection from the top layer to all inner layers, greatly improving routing density, reducing board size and enabling more compact product design. It is the preferred solution for high-complexity, miniaturized electronic products.

2. Metal Edge Plating (Side Wall Metallization)

Both side walls of the PCB are plated with continuous metal. This process delivers three core benefits:

Improved electromagnetic shielding performance when connected to the ground network

Enhanced heat dissipation capability via the metal edge structure

Reinforced board edge mechanical strength for abrasion resistance during assembly and use

Material & Surface Finish Advantages

IT180A High-Speed FR4 Substrate

IT180A is a high-Tg high-speed FR4 laminate with stable dielectric properties, low signal loss and excellent thermal reliability, suitable for high-speed digital circuit and high-density layout designs. It provides a good balance of performance and cost for mid-to-high end electronic applications.

ENIG + OSP Hybrid Surface Finish

The board adopts a hybrid surface finish scheme: critical contact areas use ENIG for stable contact resistance and corrosion resistance, while soldering pad areas use OSP for excellent solderability. This configuration matches different functional requirements across the board while optimizing total production cost.

Quality Control Standards

We implement strict full-process dimensional control to ensure all layer dimensions stay within ±0.01mm tolerance per Gerber files. All finished boards undergo 100% electrical open/short testing, via continuity inspection and metal plating thickness verification, fully complying with IPC-6012 Class 2/3 quality standards.

Typical Applications

This 10-layer ELIC metal edge PCB is widely used in high-density, high-reliability scenarios including:

High-end compact consumer electronics

5G communication module boards

Miniaturized industrial control equipment

Medical electronic devices

High-speed data transmission modules

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