Multilayer FPC

  • Six layer soft and hard combination board for Bluetooth earphones
Six layer soft and hard combination board for Bluetooth earphones

Six layer soft and hard combination board for Bluetooth earphones

Product type: Six layer soft and hard combination board for Bluetooth earphones

 

Application field: Bluetooth earphones, wearable devices

 

Material: Rigid part: Shengyi s1000-2M

 

Soft part: Shengyi double-sided adhesive free rolling

 

Plate thickness: 1.6mm

 

Process capability: small pore size